First Combisensor From SensorDynamics For Electronic Stabilizing Systems in Cars

GRAZ, Austria--SensorDynamics today announced the launch of the micromechanical combisensor SD755 for the automotive integrating gyrometer and accelerometer in one single package. Both sensors transmit their signals over a shared SPI interface that facilitates further processing as well as minimize development time and system costs. SensorDynamics, being both the pioneer and trendsetter in inertial combisensors for the automotive and manufacturing industries, has recognized the critical market need for AEC-Q100 certifiable, integrated sensors including monitoring circuitry that make them absolutely fail-safe at chip and module level. Also minimizing number of devices translates to system cost reduction. SD755 is ideally suited for applications for electronic stabilizing systems in cars that match the actual road curvature with the angle lock. When there is a difference detected, single wheels are systematically slowed down to avoid skidding. SD755 is suitable for all security related automotive or industrial applications to ensure a high degree of fail-safety. Furthermore, its features include mechanical robustness, a wide range for temperature tolerance and high stability in the long term.

The SD755 is in response to high safety standards, especially in the automobile sector. All design measures involved in achieving this are to IEC 61508 standard and are a result of thorough FMEAs of the entire system consisting of gyroscope, accelerometer and circuitry. A particular circuit for monitoring both sensor elements and the signal conditioning path is integrated and alerts immediately if a parameter goes out of precisely defined limits. More than 40 parameters are monitored to ensure that it is completely fail-safe.

Failure of any part of the combisensor is communicated to the superordinate microcontroller on an SPI interface plus an additional hard-wired line. Via SPI a detailed failure analysis can be accomplished in order to identify the source of error. The sensor is also able to monitor the microcontroller by means of SPI. On the strength of this design, the SD755 achieves SIL 2 at component level and SIL 3 at system level.

The SD755 is now available. Pricing is about 38 US$ at a quantity of 1,000 units/year. Evaluation boards are available upon customer request.