The Ceramic Interconnect Initiative
25 October 1999
ADVISORY/The Ceramic Interconnect Initiative (CII); Roundtable Discussion Wednesday Oct. 27
--WHAT: Recent findings regarding potential health hazards associated with wireless technology have been top-of-mind for consumers. This week, experts in the field of ceramic technology - the technology supporting many wireless communication devices- will meet in a round-table to discuss recent developments and trends, as well as future plans for ceramic technology. WHO: The Ceramic Interconnect Initiative (CII) of the International Microelectronics and Packaging Society (IMAPS) The Ceramic Interconnect Initiative is dedicated to increasing the awareness of the benefits of ceramic technology among OEM designers. WHEN: October 27, 1999, noon-1:30 p.m. To be held during Window to the 21st Century in Microelectronics, IMAPS 32nd International Symposium on Microelectronics WHERE: Chicago Hilton & Towers Room 5H 720 S. Michigan Avenue 312/922-4400 DETAILS: From cell phones to anti-lock brakes, use of wireless communications is exploding, and ceramic is particularly beneficial in these applications. Today, ceramic is the technology of choice for a whole new generation of designers of implantable medical devices. At the round-table, designers will discuss the benefits of ceramic technology to support wireless products, issues they face and their plans for implementations of the future.